NEW Aismalibar ebook: Thermal Dissipation in Wide-bandgap Power Semiconductors
Traditional printed circuit boards (PCBs) commonly use FR4 as an insulating material. While FR4 is widely used due to its electrical insulation properties, it exhibits a relatively low thermal conductivity, necessitating a significant number of thermal vias to effectively dissipate heat. However, experimental results have demonstrated that our new materials surpass FR4 in terms of thermal conductivity, thereby reducing or eliminating the need for thermal vias altogether. Learn more by downl...